UP TO 2X THROUGHPUT
2X FP32 THROUGHPUT
Maximize the thermal contact surface area on graphics card components
Airflow packets allow air to move more freely through the heatsink to remove more heat.
New 180° heatpipe design with selectively positioned heatpipes increases fin contact area by 65% for optimal heat dissipation
Patented copper base is 25% larger to cover both GPU and RAM area to improve thermal transfer and GPU/RAM cooling.
Triple 2nd generation HDB fans are installed to optimize airflow, increase cooling performance, and reduce fan noise.
EVGA's iCX3 fans feature a 2nd Gen optimized HDB active motor for silent 0dB mode, asynchronous fan mode, and a special upraised "E" pattern that further reduces noise
EVGA's iCX3 fans turn off below 55°C, generation 0dB of noise.